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Meet the dedicated professionals behind the 2026 1st International Electronics, Packaging, Design & Manufacturing Conference: Bridging Skills & Innovation for India's Industry
Department of Computer Science and Engineering, Sree Rama Engineering College, Tirupati, Andhra Pradesh, India
Department of Computer Science and Engineering, Sree Rama Engineering College, Tirupati, Andhra Pradesh, India
Swiss School of Business and Management, Switzerland
Riga Nordic University, Latvia
Full Stack Engineer, United States
Microsoft, USA
University of Technology and Applied Sciences-Suhar, Sultanate of Oman
Jazan University, Saudi Arabia
Kampala International University, Uganda
JSS Academy of Technical Education, India
jain univ